AMD announced a publicly available first CPU for data centers using three-dimensional crystal stacking, - AMD EPYC ™ 3D-generation processors with AMD 3D V-Cache ™ technology, previously under the codename name "Milan-X". Built on the basis of the architecture of the Zen 3 kernel, these processors expand the 4th generation EPYC family and can provide an increase in productivity up to 66% for various target technical computing workloads compared with the 3D-generation AMD EPYC comparable processors without stack.

These new processors have the largest third-level cache industry in the industry, providing the same socket, software compatibility and modern security functions as the AMD EPYC processors of the 3rd generation, while providing outstanding performance for technical computing workloads, such as Computational hydrodynamics (CFD), analysis by finite element (FEA), electronic design automation (EDA) and structural analysis. These workloads are critical design tools for companies that should simulate the complexity of the physical world to create simulations, which test and confirm engineering projects for some of the most innovative products in the world.

Packing Innovations:

An increase in the size of the cache memory was in the forefront of performance improvement, especially for workloads of technical computing, largely dependent on large data sets. These workloads benefit from increasing the size of the cache memory, however, the 2D-chip designs have physical restrictions on the amount of cache memory, which can be effectively built on the CPU.

AMD 3D V-Cache technology solves these physical problems by tying the AMD 3 core with the Cache-memory module, increasing the volume L3, minimize the delay and increasing bandwidth. This technology is an innovative step forward in the development and layout of the CPU and provides revolutionary performance in the target workloads of technical computing.

Revolutionary performance:

The world's most productive server processors for technical calculations, 4 AMD EPYC processors of the 3rd generation with AMD 3D 3D V-Cache technology provide a more rapid result of the results in the target workloads, such as:

These performance features ultimately allow customers to deploy a smaller number of servers and reduce power consumption in the data center, helping to reduce the cumulative cost of ownership (TCO), reduce carbon dioxide emissions and solve their environmental sustainability tasks. For example, in a typical data center scenario that runs 4600 tasks per day in the ANSYS® CFX® CFX -50 test script, the use of 2-processor 32-nuclear servers based on AMD EPYC 7573X processors can reduce the estimated number of required servers from 20 to 10 and Reducing energy consumption by 49 percent compared to the latest server based on a two-processor 32-nuclear processor of competitors. Ultimately, this ensures the predicted reduction in the total cost of ownership by 51 percent for three years.

In other words, the choice of AMD EPYC 3D generation processors with AMD 3D V-Cache technology for this deployment will provide environmental stability of more than 81 US forests acres per year in carbon absorption equivalent.

Support for secured ecosystem:

AMD EPYC 3D generation processors with AMD 3D V-Cache technology are available from a wide range of OEM partners, including Atos, Cisco, Dell Technologies, Gigabyte, HPE, Lenovo, QCT and Supermicro.

The AMD EPYC 3rd generation processors with AMD 3D 3D V-Cache technology are also widely supported by AMD partners by software ecosystem, including Altair, Ansys, Cadence, Dassault Systèmes, Siemens and Synopsys.

Microsoft Azure HBV3 virtual machines are now fully updated to the 3D generation AMD EPYC with AMD 3D V-Cache. According to Microsoft, the HBV3 virtual machines are the fastest addition to the Azure HPC platform from ever existed, and thanks to the addition of AMD 3D V-Cache in the HPC key loads, there is an increase of up to 80 percent compared to previous HBV3 series virtual machines.